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| CMS08 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS08 Switching Mode Power Supply Applications Portable Equipment Battery Applications * * * * Forward voltage: VFM = 0.37 V (max) Average forward current: IF (AV) = 1.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Unit: mm Maximum Ratings (Ta = 25C) Characteristics Repetitive peak reverse voltage Symbol VRRM IF (AV) (Note) IF (AV) Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature IFSM Tj Tstg Rating 30 1.0 (Ta = 51C) 1.0 (T = 106C) 25 (50 Hz) -40~125 -40~150 Unit V A A A C C Average forward current JEDEC JEITA TOSHIBA 3-4E1A Note: Device mounted on a ceramic board (board size: 50 mm 50 mm, soldering land: 2 mm 2 mm) Weight: 0.023 g (typ.) Electrical Characteristics (Ta = 25C) Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance IRRM IRRM Cj Test Condition IFM = 0.1 A IFM = 0.5 A IFM = 1.0 A VRRM = 5 V VRRM = 30 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm 2 mm) Thermal resistance Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) 3/4 Min 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 0.23 0.29 0.32 0.04 0.38 70 3/4 3/4 3/4 Max 3/4 3/4 0.37 3/4 1.5 3/4 60 C/W 135 16 C/W mA pF V Unit Thermal resistance Rth (j-) 1 2003-02-17 CMS08 Marking Following Indicates the Data of Manufacture Type code Lot No. Month of manufacture Year of manufacture January to December are denoted by letter A to L repectively. Last decimal digit of the year of manufacture 0 1 2 3 4 S8 5 6 7 8 9 Cathode mark Standard Soldering Pad Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2.1 2 2003-02-17 CMS08 iF - vF 10 0.5 PF (AV) - IF (AV) Rectangular waveform DC 0 a 360 0.3 Conduction angle: a a = 60 0.2 a = 120 a = 180 (A) Average forward power dissipation PF (AV) (W) 0.5 0.6 0.7 0.8 iF 0.4 Instantaneous forward current 125C 1 75C 25C 0.1 0.1 0 0.1 0.2 0.3 0.4 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) 140 Ta max - IF (AV) Device mounted on a ceramic board (board size: 50 mm 50 mm) Maximum allowable lead temperature T max (C) T max - IF (AV) 140 120 100 80 60 40 a = 60 Rectangular waveform a = 180 DC Maximum allowable ambient temperature Ta max (C) 120 100 80 a = 180 60 40 20 0 0 a = 120 a = 60 DC Rectangular waveform a = 120 0 a 360 IF (AV) Conduction angle: a VR = 15 V 0.6 0.8 1.0 1.2 1.4 1.6 0 a 360 IF (AV) 20 Conduction angle: a VR = 15 V 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.2 0.4 Average forward current IF (AV) (A) Average forward current IF (AV) (A) rth (j-a) - t (C/W) 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm 1.4 mm 100 Transient thermal impedance rth (j-a) Device mounted on a glass-epoxy board Soldering land: 6.0 mm 6.0 mm 10 Device mounted on a ceramic board Soldering land: 2.0 mm 2.0 mm 1 0.5 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2003-02-17 CMS08 Surge forward current (non-repetitive) 28 Cj - VR 1000 (typ.) f = 1 MHz Ta = 25C (A) 24 20 16 12 8 4 0 1 Ta = 25C f = 50 Hz Peak surge forward current IFSM Junction capacitance 10 100 Cj 100 (pF) Number of cycles 10 1 10 100 Reverse voltage VR (V) I R - Tj 1000 (typ.) Pulse test 4.0 3.6 PR (AV) - VR Rectangular waveform 0 360 (typ.) (mA) 100 Average reverse power dissipation PR (AV) (W) VR = 30 V 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 DC a 300 240 180 120 60 VR Reverse current IR 10 VR = 20 V 1 VR = 15 V VR = 10 V VR = 5 V VR = 3 V Conduction angle: a Tj = 125C 0.1 0.01 0 20 40 60 80 100 120 140 0 0 10 20 30 Junction temperature Tj (C) Reverse voltage VR (V) 4 2003-02-17 CMS08 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 5 2003-02-17 This datasheet has been download from: www..com Datasheets for electronics components. |
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